G200
3.7 Dk , 0.013 Df
200 Tg , 325 Td
/30
Isola Group’s BT family G200 is a fully proven laminate and prepreg system designed to meet today’s high reliability printed circuit board requirements.
Blending bismaleimide/triazine and epoxy resin provides G200/GI180 with enhanced thermal, mechanical and electrical performance over most epoxy materials. G200 possesses performance characteristics that make it an excellent selection for large panel size, high layer count printed wiring boards.
Key Features
Industry Approvals
- IPC-4101C /30
- UL Recognized – FR-4, File Number E41625
High Tg – 200°C (DSC)
- Superior performance through multiple thermal excursions
- Superior chemical and thermal resistance
- Low CTE from ambient to 288°C
- Excellent electrical insulation in high humidity and high temperatures (CAF Resistance)
- Very consistent dimensional stability
- Excellent layer-to-layer registration
Standard Availability
- Thickness: 0.002″ [.05 mm] to 0.125″ [3.2 mm]
- Available in sheet or panel form
- Copper Foil Cladding: Grade 3 (HTE), 1⁄8 to 3 oz.
- Foil Options: Double treat
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080, 2313, 2116, 1652 and 7628