GETEK®
3.6 Dk , 0.009 Df
180 Tg , 345 Td
/25
GETEK® materials provide the low dielectric constant (Dk) and low dissipation factor (Df) performance demanded by high speed, low loss printed wiring board (PWB) designs and applications while providing superior thermal performance and high reliability based on the systems 180°C glass transition temperature (Tg).
GETEK® laminate and prepreg products are manufactured using a functionalized, Polyphenylene Oxide/Epoxy resin, reinforced with electrical grade (E-glass) glass fabric. In addition to this superior electrical and thermal performance the mechanical, chemical and low moisture absorption properties all equal or exceed the performance of traditional FR-4 materials. The GETEK system is also UV blocking and fluorescing.
Key Features
Industry Approvals
- IPC–4101C /25
- UL Recognized – FR-4, File Number E4162
- (ML200+ and RG200+ listing)
- Qualified to UL’s MCIL Program
High Thermal Performance
- Tg of 180°C (DMA)
- Low CTE for reliability
Improved Dielectric Properties
- Dk <3.8 (50 MHz – 1 GHz) – Supports increased signal speeds
- Df <0.010 (50 MHz – 1 GHz) – Provides better signal integrity
UV Blocking and AOI Fluorescence
- High throughput and accuracy during PCB fabrication and assembly
Superior Processing
- Closest to conventional FR-4 processing of all high speed materials
Standard Availability
- Thickness: 0.002 [0.05 mm] to 0.093” [2.4 mm]
- Available in sheet or panel form
- Copper Foil Cladding: Grade 3 (HTE), ½ , 1 and 2 oz.
- Foil Options: Reverse treat
- Prepregs: Available in roll or panel form
- Glass Styles: Standard fabrics